High-force Z for the latest device types

Leading edge, multi-die and bumped 200mm wafer applications require a combination of high-throughput, high-force and extremely high chuck rigidity. The EG4|200 is the only solution designed to meet these requirements, featuring the industry's only probe centered Z-drive, delivering up to 150 kilograms of Z-force, to ensure that the probe force and contact force are always in line, no matter what portion of a wafer is being probed.

With EG4|200, you can:

• Minimize deflection and/or bending.
• Improve electrical contact.
• Reduce wafer damage during probing.
• Achieve greater probe yield for complex system-on-chip and high-parallel memory applications.