Fine-pitch probing for parametric test structures

The demands of 300mm production require highly accurate parametric testing at increasingly lower current and voltage levels. The EG5|300e is designed to answer this challenge, offering exceptional probe-to-pad accuracy to address the shrinking geometries of latest-generation devices, including the decreasing size of bond pads and increasing number of pads per die.


With the EG5|300e, you can:
  • Benefit from extremely low system noise, electrical leakage and capacitance.
  • Harness probe-to-pad accuracy of ±2.5 micron.
  • Achieve unprecedented accuracy and performance with a state-of-the-art, closed-loop motion system.








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